Research, Development & Engineering Capabilities:
- 3D modeling, Stress Strain, Vibration, Fatigue, Thermal, Mold
Flow and RF/Electromagnetic Simulation —SolidWorks, AutoDesk
Inventor, AutoCAD
- Schematic Capture, Simulation and PCB Layout —Proteus
Design Suite
- Customization and Application Configuration
- Prototyping — 3D printing, 5-axis CNC machining, Stamping,
Milling, Welding, Soldering, Brazing, PCB fabrication, Through
hole and SMT assembly
- Testing — EMI, UV, Thermal shock & cycle, Vibration, Shock,
Pressure, Vacuum, Electrical, Functional life cycle, HALT, IPX6K/
IPX9K, IK (impact), Salt fog/spray, and Chemical compatibility
Manufacturing Capabilities:
- Assembly
- Integrated Surface Mount and Wave Solder
- Selective Solder
- Electrical and Mechanical Product Calibration
- Specialized Metal Working
- Vacuum Leak Testing
- High Pressure Leak Testing
- Cleaning for Cryogenic Applications
- NC Wire Bending / Forming
- Ultrasonic & Spin Welding
- TIG, Plasma & Resistance Welding
- CNC Machining
- Stamping
- Brazing
- Soldering
- Laser Etching
- Overmolding
Special Processes:
Rochester Sensors employs the use of sub-tier suppliers to accomplish the following processes:
- Injection Molding
- Heat Treating
- Plating
- Cleaning for Cryogenic Applications
Environmental Controls:
Approximately 25% of Manufacturing Area with Temperature and Humidity Controls
